Glass electrochemical sensor with wafer level stacking and through glass via (tgv) interconnects

ABSTRACT

A method of forming a glass electrochemical sensor is described. In some embodiments, the method may include forming a plurality of electrical through glass vias (TGVs) in an electrode substrate; filling each of the plurality of electrical TGVs with an electrode material; forming a plurality of contact TGVs in the electrode substrate; filling each of the plurality of contact TGVs with a conductive material; patterning the conductive material to connect the electrical TGVs with the contact TGVs; forming a cavity in a first glass layer; and bonding a first side of the first glass layer to the electrode substrate.

CROSS-REFERENCE TO RELATED PATENT APPLICATIONS

This application claims the benefit of priority under 35 U.S.C. § 119 ofU.S. Provisional Application Ser. No. 62/491,408, filed on Apr. 28,2017, the content of which is relied upon and incorporated herein byreference in its entirety.

BACKGROUND

The deployment of mobile, low cost sensors in phones, tablets,automobiles, healthcare products, and many consumer products is a globaltechnology mega-trend that is attracting major investment in developingminiaturized, low cost designs of many existing sensor technologies.Sensors such as accelerometers, gyroscopes, microphones, cameras, andlight sensors are manufactured in tens of millions of units per month inform factors that are compatible with mobile devices and consumerelectronics. These sensors are typically produced having dimensions ofjust a few square millimeters, and are typically very low cost. Mobilephones and other personal mobile electronics are driving this marketalong with the integration of sensors in many new and existing productssuch as home appliances, wearable health monitors, and industrialequipment. This connected sensor deployment is a global mega-trend knownas “The Internet of Things” (IoT).

Electrochemical sensors are an important subclass of chemical sensors.These devices may be used to sense a broad range of chemicals, rangingfrom toxic gases to biological compounds. These devices function bymonitoring changes in conductivity, potential, or current betweenelectrodes in a cell containing an electrolyte. Typicallyelectrochemical sensors have a working electrode, a counter electrode,and a reference electrode, all immersed in an electrolyte.

SUMMARY

The present disclosure is directed to a method for forming a glasselectrochemical sensor. In some embodiments, the method may includeforming a plurality of electrical through glass vias (TGVs) in anelectrode substrate; filling each of the plurality of electrical TGVswith an electrode material; forming a plurality of contact TGVs with aconductive material; patterning the conductive material to connect theelectrical TGVs with the contact TGVs; forming a cavity in a first glassplate; and bonding a first side of the first glass plate to theelectrode substrate.

In some embodiments, the method may further include bonding a secondside of the first glass plate to a second glass plate. In someembodiments, the second glass plate may be solid, such that the cavityin the first glass plate is sealed by glass on three sides.

In some embodiments, bonding the first glass plate to the electrodesubstrate and bonding the first glass plate to the second glass platemay include bonding the first glass plate, the electrode substrate, andthe second glass plate using at least one of adhesive, glass frit,thermal bonding such as laser sealing, or a combination thereof.

In some embodiments, the method may further include coupling the bondedfirst glass plate and second glass plate to a printed circuit boardconfigured to detect a change in conductivity, potential, or currentbetween electrodes indicating a detectable concentration of a gasentering the cavity in the first glass plate.

In some embodiments, the plurality of electrical TGVs may be positionedaround a center of the electrode substrate, and the plurality of contactTGVs may be positioned around a periphery of the electrode substrate.

In some embodiments, at least one of forming the plurality of electricalTGVs and forming the plurality of contact TGVs may include forming theplurality of TGVs with a laser, and defining the plurality of TGVs withan acid etch.

In some embodiments, at least one of the first glass plate and thesecond glass plate may include a glass wafer.

In some embodiments, the electrode material may include a noble metalwhich may include one of platinum, gold, or a combination thereof.

In some embodiments, the conductive material may include any of copper,gold, aluminum, a conductive polymer, or a combination thereof.

In some embodiments, filling each of the plurality of contact TGVs withthe conductive material may include filling the electrode TGVs by any ofpaste-filling, electroplating, physical vapor deposition (PVD) whichincludes sputtering, thermal and e-beam evaporation, and laser ablation,chemical vapor deposition, atomic-layer deposition, or a combinationthereof.

In some embodiments, the first glass plate may include any of Pyrex®,quartz, soda-lime glass, aluminosilicate glass, alkali-aluminosilicateglass, borosilicate glass, alkali-borosilicate glass,aluminoborosilicate glass, alkali-aluminoborosilicate glass, fusedsilica glass, or any combination thereof.

The present disclosure is also directed to a glass electrochemicalsensor having an electrode substrate layer and a first glass plate layerincluding a cavity. In some embodiments, the electrode substrate layermay be bonded to a first side of the first glass plate layer. In someembodiments, the electrode substrate layer may include a plurality ofelectrical through glass vias (TGVs), and the plurality of electricalTGVs may be filled with an electrode material.

In some embodiments, the electrochemical sensor may further include aconductive material redistribution layer (RDL) applied to a surface ofthe electrode substrate layer.

In some embodiments, the electrode substrate layer may further include aplurality of contact TGVs, and the plurality of contact TGVs may befilled with a conductive material. In some embodiments, the conductivematerial may be patterned to connect the electrical TGVs with thecontact TGVs.

In some embodiments, the plurality of electrical TGVs may be positionedaround a center of the electrode substrate layer, and the pluralitycontact TGVs may be positioned about a periphery of the electrodesubstrate layer.

In some embodiments, the glass electrochemical sensor may furtherinclude a second glass plate layer. In some embodiments, the secondglass plate layer may be bonded to a second side of the first glassplate layer, and the second glass plate layer may be solid, such thatthe cavity in the first glass plate can be sealed by glass on at leastthe bottom, all sides, and a portion of the top.

In some embodiments, the second glass plate layer may be bonded to thefirst glass plate layer by at least one of adhesive, glass frit, lasersealing, or a combination thereof.

In some embodiments, the bonded first glass plate layer and the secondglass plate layer may be coupled to a printed circuit board, configuredto detect a change in conductivity, potential, or current betweenelectrodes indicating a detectable concentration of a gas entering thecavity in the first glass plate layer.

The present disclosure is further directed to an electronic deviceincluding the glass electrochemical sensor as previously recited.

One or more representative embodiments is provided to illustrate thevarious features, characteristics, and advantages of the disclosedsubject matter. The embodiments are provided in the context of glasselectrochemical sensors. It should be understood, however, that many ofthe concepts may be used in a variety of other settings, situations, andconfigurations. For example, the features, characteristics, advantages,etc., of one embodiment may be used alone or in various combinations andsub-combinations with one another.

The Summary is provided to introduce a selection of concepts in asimplified form that are further described below in the DetailedDescription. The Summary and the Background are not intended to identifykey concepts or essential aspects of the disclosed subject matter, norshould they be used to constrict or limit the scope of the claims. Forexample, the scope of the claims should not be limited based on whetherthe recited subject matter includes any or all aspects noted in theSummary and/or addresses any of the issues noted in the Background.

BRIEF DESCRIPTION OF THE DRAWINGS

The preferred and other embodiments are disclosed in association withthe accompanying drawings in which:

FIG. 1 is a cross-sectional view of an example of the elements of aconventional electrochemical sensor;

FIG. 2 is a cross-sectional view of an example glass-basedelectrochemical sensor;

FIG. 3 is an example method for formation of a glass electrochemicalsensor with wafer level stacking and through glass via (TGV)interconnects;

FIG. 4 is an alternate example method for formation of a glasselectrochemical sensor with wafer level stacking and TGV interconnects;

FIG. 5 is an alternate example method for formation of a glasselectrochemical sensor with wafer level stacking and TGV interconnects;

FIG. 6 is a top view of an example glass electrochemical sensor withwafer level stacking and TGV interconnects;

FIG. 7 is an exploded view of an example glass electrochemical sensorwith wafer level stacking and TGV interconnects;

FIG. 8 is a perspective view of an example glass electrochemical sensorwith wafer level stacking and TGV interconnects;

FIG. 9 is an example method for wafer-level processing and formation ofa three-layer stack;

FIGS. 10a and 10b illustrate an example TGV placement layout for a fourelectrode glass-based electrochemical sensor; FIG. 10a illustrates theexample TGV placement layout with die level layout, and FIG. 10billustrates the example TGV placement layout with 692 die per wafer;

FIG. 11 is a representative image of a fluid hole and TGVs in an exampleglass electrochemical sensor;

FIG. 12 is a representative image of an interposer wafer layout withoctagonal apertures;

FIG. 13 is a flow chart illustrating an example method for formation ofa glass electrochemical sensor with wafer level stacking; and

FIG. 14 depicts a block diagram of an example computer system suitablefor implementing the present systems and methods.

DETAILED DESCRIPTION

The present system includes a design for a glass-based electrochemicalcell for chemical and biochemical sensing systems including, but in noway limited to, an air quality sensor for mobile consumer electronicapplications. Smaller devices enable incorporation in IOT applicationslike smart phones, wearables, automobiles, home security monitoring, andappliances, to name a few. Miniaturization of these devices makes use ofglass as a material an attractive option due to its chemical durability,dimensional tolerances, coefficient of thermal expansion (CTE) match tosilicon, temperature stability, and low gas permeability.

The present disclosure relates to methods of forming a glasselectrochemical sensor. FIG. 1 shows a cross-section of the basicelements of a traditional electrochemical sensor 100. As shown in FIG.1, the traditional electrochemical sensor 100 may include a capillarydiffusion barrier 105, a hydrophobic membrane 110, a working or sensingelectrode 115, a reference electrode 120, a counter electrode 125, andan electrolyte 130. This traditional electrochemical sensor 100 istypically packaged in a polymer.

According to one embodiment of the traditional electrochemical sensor100, the hydrophobic membrane 110 or gas permeable membrane is used tocover the sensor's electrode and control the amount of gas moleculesreaching the electrode surface. The gas permeable membrane may be madeof any number of Teflon membranes having varying porosity, depending onthe desired application. In one embodiment, the hydrophobic membrane 110also prevents liquid electrolyte from leaking out or drying out thesensor too quickly.

The electrolyte 130 facilitates the cell reaction and carries the ioniccharge across the electrodes efficiently. Further the electrolyte formsa stable reference potential with the reference electrode and can becompatible with the materials used within the sensor. Prematureevaporation of the electrolyte will result in premature signaldeterioration. The electrolyte may be selected based on the chemicalreactivity of the target gas and may include, but is in no way limitedto, a mineral acid or an organic electrolyte.

The working or sensing electrode 115 is formed of a catalyzed materialwhich performs the half-cell reaction over a long period of time.Typically, the electrode is made from a noble metal, such as platinum orgold, and is catalyzed for an effective reaction with gas molecules.Depending on the design of the sensor, all three electrodes (115, 120,125) may be made of different materials to complete the cell reaction.

In operation, a gas may enter the traditional electrochemical sensor 100through the capillary diffusion barrier 105, where the gas may come intocontact with the sensing or working electrode 115. The traditionalelectrochemical sensor 100 may then measure the concentration of the gasby oxidizing or reducing the gas at the sensing electrode 115 andmeasuring the resulting current. At the counter electrode 125, an equaland opposite reaction occurs, such that if the sensing electrode 115 isan oxidation, the counter electrode 125 is a reduction. An externalcircuit (not shown) maintains the voltage across the traditionalelectrochemical sensor 100 between the sensing electrode 115 and thecounter electrode 125, and between the sensing electrode 115 and thereference electrode 120.

In contrast to the traditional electrochemical sensor 100 illustrated inFIG. 1, which is traditionally packaged in polymer, the presentexemplary system and method provides for a miniaturized glasselectrochemical cell. According to this exemplary method, precisionlaser technologies are used to form high throughput compatible throughglass vias (TGVs), also called “vias” herein, and larger structuralglass cavities with tight dimensional tolerances in glass wafers. Thevias can be formed by the methods taught in, for example, InternationalPat. App. No. PCT/US2014/070459; U.S. Pat. No. 9,278,886; and (3) U.S.Pat. No. 9,321,680, which references are incorporated herein byreference for all that they disclose. The vias can be formed to extendthrough a layer of glass, from one surface to another. The formation ofvias that extend from a first surface of a layer of glass to anothersurface of a layer of glass enable the embedding of conductors tofacilitate conductivity with appropriate electrodes within the cavitywhile providing electrical leads to a surface outside the cavity. Theexemplary process enables miniaturization of the components, reducingtheir cost and facilitating their adoption into mobile or IoTapplications. Furthermore, as will be detailed below, the presentexemplary system and method provide for enhanced temperature stability,chemical durability, easy surface modification and functionalization,and may be incorporated into wafer-scale processing.

FIG. 2 is a cross-section diagram showing an exemplary high-level designof a miniature glass-based electrochemical sensor 200, according to thepresent disclosure. In the illustrated example, cavity 215 is containedwithin a glass article, with an aperture 205 to facilitate gastransmission into the cavity 215. Within the cavity 215 is anelectrolyte 230 and electrodes 210. FIG. 2 shows possible locationswithin the cavity 215 for the electrodes 210, but is not intended to belimiting as to the locations or number of electrodes 210 utilized.Rather, FIG. 2 illustrates how electrical connections may be formed tofacilitate electrical connection between the electrodes 210 and theoutside of the glass article. Design and placement of the electrodes 210may vary depending on the desired characteristics and sensitivity of theglass-based electrochemical sensor 200. However, as illustrated in FIG.2, placement of the electrodes on the cavity 215 of the glass articlepresents a need for through glass vias (TGVs) to minimize theglass/metal interface thereby minimizing leakage of the electrolyte.

FIGS. 3-5 illustrate a cross-sectional view of a glass sheet having viasformed therein. FIGS. 3-5 illustrate various methods for forming thedesired through glass vias in the glass sheet. While the glass sheet303, 403, 503 illustrated in FIGS. 3-5 is shown as a single layer ofglass, the glass sheet could be any number of structures including, butin no way limited to, a laminate of several sheets of glass joined orbonded together. The laminate may include one or more interlayersbetween the glass sheets including, but not limited to polyvinyl butyral(PVB), polycarbonate, acoustic PVB, ethylene vinyl acetate (EVA),thermoplastic polyurethane (TPU), an ionomer, a thermoplastic material,or combinations thereof.

FIG. 3 is an example method 300 for formation of the desired throughglass vias in the upper layer of the glass-based electrochemical sensor.As mentioned, the use of through glass vias (TGVs) that extend from afirst surface of a glass layer to a second surface of the glass layerfacilitates the connection between the top or bottom surface of theglass sensor and the electrodes, while minimizing the glass/metalinterface, thereby minimizing the potential for leaking of theelectrolyte 230. According to the exemplary method 300, a glass sheet303 acting as an electrode substrate may be patterned to form aplurality of TGVs (step a). In some examples, the TGVs may be formed ina sheet of glass using a laser system. According to one embodimentdescribed below, some of the TGVs formed may be dimensioned andpositioned to serve as electrode TGVs 305, while others may bedimensioned and positioned to serve as contact TGVs 310. As illustratedin FIG. 3, the electrode TGVs 305 have a smaller diameter than thecontact TGVs 310. However, the relative size between the contact TGVs310 and the electrode TGVs 305 may vary. Depending on the intended useof the resulting patterned glass, one or more of the exemplary contactTGVs 310 and electrode TGVs 305 may be formed on the glass. As shownherein, for use as an electrochemical sensor, at least two electrodeTGVs 305 and at least two contact TGVs 310 are formed to allow for asensing and counter electrode.

As shown in FIG. 3, once the glass sheet 303 is patterned with at leasttwo electrode TGVs 305 and at least two contact TGVs 310, the pluralityof electrode TGVs 305 may be metallized by being at least partiallyfilled with an electrode material 320. While described herein as beingat least partially filled with an electrode material 320, other methodsfor metallizing the electrode TGVs may be used including, but in no waylimited to, a conformal metal coating to provide the conductive path andthen hermetically sealing the via with a polymer fill material. As usedherein, the term “electrode material” refers to a material used to formthe electrode in the present glass-based electrochemical sensor. Theelectrode material 320 is typically a corrosion and oxidation resistantmaterial that can be used to act as an electrode while maintaining ahermetic seal with the glass layer. The electrode material 320 may bemade of a noble metal including, but in no way limited to, platinum,silver, gold, or combinations thereof (step b). In other embodimentswhere corrosion and oxidation are less sensitive, or the useful life ofthe sensor is less, other metals such as copper, or combinations ofmetals can be used to form the electrode material. Furthermore, if theresulting glass-based electrochemical sensor is to be used forbiological applications, the sensor may be made of a self-assembledmonolayer (SAM) or a material having bound functionalities on the metalelectrodes.

Once the electrode TGVs 305 are metallized or otherwise hermeticallysealed, the plurality of contact TGVs 310 are at least partially filledwith a conductive material 325. Conductive material 325 may includecopper, gold, aluminum, silver, platinum, tin, lead, a conductivepolymer, or combinations thereof (step c). Copper or another conductivematerial may be added to form a connection bridge 330 between thematerial in the electrode TGVs 305 and the material in the contact TGVs310 (step d), which will subsequently be connected to a printed circuitboard (PCB) or other processing interface. According to one embodiment,the material added to form the connection bridge 330 may include, but isin no way limited to, copper, gold, aluminum, silver, platinum, tin,lead, a conductive polymer, or combinations thereof. A hole 315 may beformed through the glass sheet to define the gas sensing port for theminiature glass-based electrochemical sensor 200 (step e). In someexamples, the hole 315 may have a diameter of about 400 μm, or about 300μm, or about 200 μm, or about 100 μm or less, including all rangestherebetween; in other examples, the hole 315 may have a diameter ofsome other suitable size. According to one exemplary embodiment, thehole 315 is sized such that the electrolyte 230 is maintained in thecavity 215 of the miniature glass-based electrochemical sensor 200 viacapillary action. Alternatively, the electrolyte may be maintained inthe cavity by a hydrophobic or gas permeable membrane (not shown)adjacent hole 315. Once formed and metallized, the glass sheet maysubsequently be bonded to one or more lower glass plate(s) having acavity therein, as illustrated in FIGS. 7 and 8, in order to form theglass-based electrochemical sensor 200, which may then be electricallycoupled to a PCB or other processing interface.

In another embodiment, illustrated in FIG. 4, an alternate method 400for formation of a glass-based electrochemical sensor may be used, inwhich less precious metal is needed to form the sensor, when compared tothe method of FIG. 3. According to the exemplary method 400 illustratedin FIG. 4, a glass sheet 403 acting as an electrode substrate may bepatterned to form a plurality of TGVs (step a), similar to the methodillustrated in FIG. 3. In some examples, the TGVs may be formed in glasssheet 403 using a laser system. Formation of the TGVs may be performedby a laser ablation or a laser damage process to localized areas onglass sheet 403, optionally followed by etching of the localized areas,if needed, to remove the ablated or damaged material to form the TGVs.Some of the TGVs formed may be electrode TGVs 405, while others may becontact TGVs 410. Once patterned, the plurality of electrode TGVs 405are at least partially filled with an electrode material 420. Theelectrode material 420 is typically a corrosion and oxidation resistantmaterial that can be used to act as an electrode while maintaining ahermetic seal with the glass layer. The electrode material 420 may bemade of a noble metal including, but in no way limited to, platinum,silver, gold, or combinations thereof (step b).

As shown in FIG. 4, less electrode material is deposited in eachelectrode via 405, when compared to the method of FIG. 3. Following theat least partial filling of the electrode TGVs 405 with electrodematerial 420, the remaining volume of the plurality of electrode TGVs405 and the plurality of contact TGVs 410 are at least partially filledwith a conductive material 422, 425, such as copper, gold, aluminum,silver, platinum, tin, lead, a conductive polymer, or combinationsthereof (step c). Copper or another conductive material may then beadded to form a connection bridge 430 between the material in theelectrode TGVs 405 and the material in the contact TGVs 410 (step d).According to one embodiment, the material added to form the connectionbridge 430 may include, but is in no way limited to, copper, gold,aluminum, silver, platinum, tin, lead, a conductive polymer, orcombinations thereof. Furthermore, while the present method is describedas at least partially filling the plurality of electrode TGVs 405 andthe plurality of contact TGVs 410, and forming the connection bridge 430with a conductive material 422, 425 in separate steps, the partialfilling of the electrode TGVs 405 and the plurality of contact TGVs 410,as well as the formation of the connection bridge 430 can be performedin a single step with the same or different material.

A hole 415 may be formed through the glass sheet to define the gassensing port for the miniature glass-based electrochemical sensor 200(step e). In some examples, the hole 415 may have a diameter of about400 μm, or about 300 μm, or about 200 μm, or about 100 μm or less,including all ranges therebetween; in other examples, the hole 415 mayhave a diameter of some other suitable size. The glass sheet 403 maysubsequently be joined to a lower glass plate or plates having a cavitytherein, in order to form the glass-based electrochemical sensor 200,which may then be electrically coupled to a PCB or other processinginterface.

FIG. 5 is an example of yet another alternate method 500 using TGVs forthe formation of electrodes on a glass substrate that can then be usedto form a glass-based electrochemical sensor. According to the method500 illustrated in FIG. 5, a glass sheet 503 acting as an electrodesubstrate may be patterned to form a plurality of TGVs (step a). In someexamples, the TGVs may be formed in a glass sheet 503 using a lasersystem and applicable methods as described above. In the illustratedembodiment, the TGVs may include electrode TGVs 505. Once formed, theplurality of electrode TGVs 505 are at least partially filled with aplug of a conductive material 525, such as copper, gold, aluminum, aconductive polymer, or combinations thereof (step b). In someembodiments the electrode vias TGVs may be at least partially filledwith a conductive metal, typically copper or silver, deposited byelectroless or electroplating, or physical vapor deposition (PVD) whichincludes sputtering, thermal and e-beam evaporation, and laser ablationmethods, or it may be a conductive paste deposited by silk screen,doctor blade, or ink jet printing. Conductive pastes include metalpastes which contain a majority of metal such as copper, platinum, orsilver along with solder glass, binder and organic solvents.Alternatively the paste may comprise a low melting solder such as Sn—Pb,Sn—Ag—Cu or Sn—Sb. Alternatively metal (typically Ag or Cu) filledpolymer pastes may also be used. The holes may then be planarized tosmooth the surfaces with any combination of chemical and mechanicalforces. Additionally, copper or some other conductive material may beadded to form a connection bridge 530 between the material in theelectrode TGVs 505 on a first side of the glass sheet 503, and anelectrode material 520, such as platinum that, may be deposited on asecond side of the glass sheet 503, as described above (step c). Withthe electrode material formed, a hole 510 may be formed through theglass sheet 503 (step d). In some examples, the hole 510 may have adiameter of 400 μm, or about 300 μm, or about 200 μm, or about 100 μm orless, including all ranges there between; in other examples, the hole510 may have a diameter of some other suitable size. The glass sheet 503may subsequently be bonded to a lower glass plate or plates having acavity therein, in order to form the glass-based electrochemical sensor.

While the present exemplary systems and methods have been described inFIGS. 3-5 as forming the electrodes and contacts in the top portion ofthe electrochemical sensor, any number of access points and orientationsmay be achieved by the present systems and methods to be incorporatedinto an electrochemical sensor, including a bottom or side placement ofthe electrodes and/or contacts on the glass sheet 303, 403, 503.

FIG. 6 is a top view of an exemplary glass-based electrochemical sensorplate 600, according to one embodiment. As illustrated, the glass-basedelectrochemical sensor plate 600 may include a plurality of platinum orother electrode material-filled electrode TGVs 605, and a plurality ofcopper or other conductive material-filled contact TGVs 610. Theplurality of electrode TGVs 605 may be connected to the plurality ofcontact TGVs 610 with a plurality of copper pads or traces forming aconnection bridge 615. The plurality of copper pads or traces that makeup the connection bridges 615 form a redistribution layer (RDL), used toroute connectivity to a printed circuit board or other electricalcircuit. The glass-based electrochemical sensor plate 600 may be bondedto a lower glass plate having a cavity therein, in order to form theglass-based electrochemical sensor. The illustrated electrode TGVs 605and contact TGVs 610 may be formed according to any of the exemplarymethods illustrated in FIGS. 3-5 detailed above.

FIG. 7 is an exploded perspective view of a glass-based electrochemicalsensor 700, according to one exemplary embodiment. As shown, theglass-based electrochemical sensor 700 may include three layers: aglass-based electrochemical sensor plate 710, which may be an example ofthe glass-based electrochemical sensor plate 600 illustrated in FIG. 6;a middle glass layer 720 having a cavity 725 therein; and a bottom glasslayer 730. Furthermore, as shown in FIG. 7, the glass-basedelectrochemical sensor plate 710 may include a plurality of electrodeTGVs 715 connected to a plurality of electrodes 718 formed on theunderside of the glass-based electrochemical sensor plate 710, and aplurality of contact TGVs 705, which may be examples of electrode TGVs605 and contact TGVs 610 illustrated in FIG. 6. Each of the three layers710, 720, 730 may be bonded together to form the glass-basedelectrochemical sensor 700, and contact TGVs 705 formed in each layercan be connected to transfer a signal to the underside of the bottomglass layer. For ease of explanation, FIG. 7 does not show the pluralityof copper pads or traces forming the connection bridge between electrodeTGVs 715 and contact TGVs 705 to form the RDL.

FIG. 8 is an assembled perspective view of a glass-based electrochemicalsensor 800, according to one exemplary embodiment. As shown, theglass-based electrochemical sensor 800 may be an example of theglass-based electrochemical sensor 700, illustrated in FIG. 7. Again,for illustrative purposes, the plurality of copper pads or tracesbetween electrode TGVs 815 and contact TGVs 805 are not shown. Theglass-based electrochemical sensor 800 may be formed of three layers,including a sensor plate 810, a middle glass layer 820 having a cavitytherein, and a bottom glass layer 830. The sensor plate 810 can includea plurality of electrode TGVs 815 that extend from the top surface ofthe sensor plate to a number of electrodes 818 formed on the undersideof the sensor plate 810 where they are exposed to the cavity (not shown)formed in the middle glass layer 820. Additionally, the sensor plate 810can include contact TGVs 805 that extend through from the top surface ofthe sensor plate 810, through the middle glass layer 820, and to thebottom surface of the bottom glass layer 830 where they can then beattached to a PCB or other processing interface.

In an alternate embodiment, rather than placing the plurality of filledelectrode and contact vias in the top sensor plate 810, the vias couldinstead be formed on the bottom glass layer 830. This configurationwould eliminate the need for the contact TGVs 805. In this alternateembodiment, an RDL would be applied to the underside of the bottom glasslayer. A gas port 840 is then be added to the top sensor plate 810 toallow gas into the cavity and into contact with the plurality ofelectrode vias in the bottom glass layer. While FIGS. 7 and 8 aredescribed as forming the glass-based electrochemical sensor 800 from 3separate glass layers, the exemplary glass-based electrochemical sensor800 may be formed from two separate glass layers if the bottom layer isa single glass layer having an appropriate cavity formed therein, whichcavity may be formed by a laser ablation or a laser damage process tolocalized areas on the top sensor plate 810, optionally followed byetching of the localized areas, if needed, to remove the ablated ordamaged material to form the TGVs.

FIG. 9 is an illustration of an example of a wafer-level processingmethod 900 for forming a three-layer stack. As illustrated in FIG. 9, aglass lid 905, a glass interposer layer 910, and a bottom glass layer915 may be bonded together to form a sealed stack 920. In some examples,the bonding may be accomplished using an adhesive if the chemistry ischemically compatible, glass frit, or by laser sealing. As mentionedabove, the electrode TGVs and contact TGVs may be formed, at leastpartially filled and/or fully metalized in either the glass lid 905, theglass interposer layer 910, and/or the bottom glass layer 915, dependingon the sensor design. Once the sealed stack is formed, including theformation of the electrodes and electrical contacts, if formed usingwafer-level processing methods, the glass lid 905 will contain aplurality of die sensor layouts, including electrode material 320, 420,520 (which may be formed into electrodes), conductive material 325, 425,525 (which may be formed in contacts), and connection bridges 330, 430,530 for forming a plurality of glass sensors, the glass interposer layer910 will have a plurality of corresponding cavities, and the bottomglass layer will complete the cavity 215 of each of the now assembledglass-based electrochemical sensors 200. Once assembled, each of theassembled glass-based electrical sensors can be cut or punched out fromthe sealed stack 920 and electrically connected to a printed circuitboard (PCB) or other processing interface, and then for use in anelectronic device. Example electronic devices include, but are in no waylimited to, smart phones, wearables, automobiles, home securitymonitoring, TSA monitoring devices, emissions sensors, cabin air qualitysensors, indoor air quality sensors, and standard appliances, to name afew.

FIGS. 10a and 10b illustrate an example TGV placement for afour-electrode glass-based electrochemical sensor. More specifically,FIG. 10a illustrates a die level layout 1000-a of the electrochemicalsensor. As is illustrated in FIG. 10a , the die level layout includes anumber of contact TGVs 1010, electrode TGVs 1005, and a gas port 1015.FIG. 10b illustrates a wafer layout 1000-b, having 6102 die levellayouts 1000-a per wafer 1030. As is illustrated in FIG. 10b , thepresent exemplary system and method enable the rapid production of ahigh volume of glass-based electrochemical sensors. Specifically, oneadvantage of using glass wafers with laser processing to form the TGVsis the ability to apply wafer-level processing to the manufacturingprocess, thereby reducing cost and increasing manufacturability.

FIG. 11 is an image 1100 of a gas port 1105 and a plurality of TGVs 1110that were formed in a wafer using laser processing, followed by an acidetch process, as described above. As illustrated in the image of FIG.11, the gas port 1105 was formed having an about 400 microns diameter,and the plurality of TGVs 1110 were formed having a diameter ofapproximately 50 microns each. While the gas port 1105 was formed withan about 400 microns diameter and the TGVs 1110 were formed with adiameter of approximately 50 microns, the present exemplary method maybe used to form vias and holes in a glass wafer ranging from thediameter of the laser used in the laser ablation or laser damageprocess, to a centimeter or more.

FIG. 12 is an illustration of a glass wafer 1200 that was processed withlaser processing and acid etch method described herein to form aplurality of TGVs 1210. Glass wafer 1200 may be called a glassinterposer layer 910, having a plurality of pockets, either formedthrough the wafer as TGVs, or only formed partially through the glasswafer 1200, patterned on the surface thereof to serve as the cavity inthe assembled sensor. This layer can be used to form the cavity portionof the glass-based electrical sensor, such as that illustrated as 725 inFIG. 7, which may then be joined with an upper layer and a lower layer,as described above, to form the glass-based electrical sensor.

FIG. 13 is an exemplary method 1300 for forming a glass-basedelectrochemical sensor 200, according to some embodiments of the presentdisclosure. As illustrated, the method 1300 may include forming aplurality of through glass vias (TGVs) 305, 405, 505 for forming aplurality of electrodes in a glass sheet 303, 403, 503 that will serveas an electrode substrate, as described above (step 1305). Once theelectrode TGVs 305, 405, 505 are formed, each of the plurality ofelectrode TGVs may be filled with an electrode material 320, 420, 520(step 1310). Additionally, a plurality of contact TGVs 310, 410, 510 maybe formed in the glass sheet 303, 403, 503 to facilitate electricalcontact between the glass-based electrochemical sensor 200 and a PCB orother processing interface (step 1315). Additional patterning may beperformed on the conductive material to form a connection bridge 330,430, 530 that connects the material in the electrode TGVs 305, 405, 505with the contact TGVs 310, 410, 510 (step 1320). Once the patterning iscomplete and the electrode TGVs 305, 405, 505 are in electrical contactwith the material disposed in the contact TGVs 310, 410, 510, at leastone hole 315, 415, 510 may be formed in the glass substrate (step 1325).When the glass substrate containing the electrodes is formed, accordingto one exemplary embodiment, a second glass plate may be bonded to thefirst glass substrate containing the electrodes (step 1330). As notedabove, if the second glass plate includes an orifice sealed everywhereexcept where it will be bonded to the electrode substrate or first glasssubstrate, a single glass plate can be bonded to the electrode substrateto complete the glass-based electrical sensor. If, however, the secondglass plate has one or more through-holes, a third glass plate may beused to seal the through-hole and define the cavity of the glass-basedelectrical sensor.

Once the first glass plate including the electrodes is bonded to theappropriate glass plates, each resulting glass-based electrical sensorcan be separated from the sealed stack, an electrolyte may be insertedinto the chamber, and the glass-based electrical sensor may then beelectrically connected to a printed circuit board (PCB) or otherprocessing interface, and then assembled with a larger device,including, but in no way limited to, smart phones, wearables,automobiles, home security monitoring, and appliances, to name a few.

FIG. 14 depicts a block diagram of a computer system 1400 suitable forimplementing the present exemplary glass-based electrical sensor 1460.The depicted computer system 1400 may be one example of a devicedescribed above, such as a smart phone, a wearable, an automobile, ahome security monitoring system, or another appliance. While describedin detail with a number of components, the present exemplary glass-basedelectrical sensor 1460 can be incorporated into any number of computingsystems including all, some, or none of the elements detailed in FIG.14. Particularly, the present glass-based electrical sensor 1460 can beconnected to a system on a chip (SOC) device wherein the functionalityof the sensor is associated with the other components on the chip,rather than through a bus or other system.

As shown in FIG. 14, the computer system 1400 includes a bus 1402 whichinterconnects major subsystems of computer system 1400, such as acentral processor 1404, a system memory 1406 (typically RAM, but whichmay also include ROM, flash RAM, or the like), an input/outputcontroller 1408, an external audio device, such as a speaker system 1410via an audio output interface 1412, an external device, such as a disk,card, or chip unit 1432 operative to receive a disk, memory card, or achip 1434; a display screen 1414 via display adapter 1416; serial ports1418 and mouse 1420; a keyboard 1422 (interfaced with a keyboardcontroller 1424); multiple USB devices 1426 (interfaced with a USBcontroller 1428); a storage interface 1430; a host bus adapter (HBA)interface card 1436A operative to connect with a Fibre Channel network1438; a host bus adapter (HBA) interface card 1436B operative to connectto a SCSI bus 1440; and an optical disk drive 1442 operative to receivean optical disk 1444. Also included are a mouse 1446 (or otherpoint-and-click device, coupled to bus 1402 via serial port 1418), anetwork modem 1448 (coupled to bus 1402 via serial port 1418), and anetwork interface 1450 (coupled directly to bus 1402).

Bus 1402 allows data communication between central processor 1404 andsystem memory 1406, which may include read-only memory (ROM) or flashmemory (neither shown), and random access memory (RAM) (not shown), aspreviously noted. The RAM is generally the main memory into which theoperating system and application programs are loaded. The ROM or flashmemory can contain, among other code, the Basic Input-Output system(BIOS) which controls basic hardware operation such as the interactionwith peripheral components or devices. Applications resident withcomputer system 1400 are generally stored on and accessed via anon-transitory computer readable medium, such as a hard disk drive(e.g., fixed disk drive 1452), an optical drive (e.g., optical diskdrive 1442), or other storage medium. Additionally, applications can bein the form of electronic signals modulated in accordance with theapplication and data communication technology when accessed via networkmodem 1448 or network interface 1450.

Storage interface 1430, as with the other storage interfaces of computersystem 1400, can connect to a standard computer readable medium forstorage and/or retrieval of information, such as a fixed disk drive1452. Fixed disk drive 1452 may be a part of computer system 1400 or maybe separate and accessed through other interface systems. Network modem1448 may provide a direct connection to a remote server via a telephonelink or to the Internet via an internet service provider (ISP). Networkinterface 1450 may provide a direct connection to a remote server via adirect network link to the Internet via a POP (point of presence).Network interface 1450 may provide such connection using wirelesstechniques, including digital cellular telephone connection, CellularDigital Packet Data (CDPD) connection, digital satellite data connectionor the like.

As illustrated in FIG. 14, the glass-based electrochemical sensor 1460may be integrated into the computer system 1400. When theelectrochemical sensor detects a chemical or a programmed level of achemical, a signal may be transmitted through the bus to the centralprocessor 1404, which may then access instructions on the system memory1406, that dictate what subsequent action is taken by the centralprocessor 1404, if any.

Many other devices or subsystems (not shown) may be connected in asimilar manner (e.g., document scanners, digital cameras and so on).Conversely, all of the devices shown in FIG. 14 need not be present topractice the present systems and methods. The devices and subsystems canbe interconnected in different ways from that shown in FIG. 14. Theoperation of at least some of the computer system 1400 such as thatshown in FIG. 14 is readily known in the art and is not discussed indetail in this application. Code to implement the present disclosure canbe stored in a non-transitory computer-readable medium such as one ormore of system memory 1406; a disk, memory card, or chip 1434; a fixeddisk drive 1452; or optical disk 1444. The operating system provided oncomputer system 1400 may be MS-DOS®, MS-WINDOWS®, OS/2®, UNIX®, Linux®,or another known operating system.

It should be appreciated that some components, features, and/orconfigurations may be described in only one embodiment, but these samecomponents, features, and/or configurations may be applied or used in orwith many other embodiments and should be considered applicable to theother embodiments, unless stated otherwise or unless such a component,feature, and/or configuration is technically impossible to use with theother embodiment. Thus, the components, features, and/or configurationsof the various embodiments may be combined in any manner and suchcombinations are expressly contemplated and disclosed by this statement.

The terms recited in the claims should be given their ordinary andcustomary meaning as determined by reference to relevant entries inwidely used general dictionaries and/or relevant technical dictionaries,commonly understood meanings by those in the art, etc., with theunderstanding that the broadest meaning imparted by any one orcombination of these sources should be given to the claim terms (e.g.,two or more relevant dictionary entries should be combined to providethe broadest meaning of the combination of entries, etc.) subject onlyto the following exceptions: (a) if a term is used in a manner that ismore expansive than its ordinary and customary meaning, the term shouldbe given its ordinary and customary meaning plus the additionalexpansive meaning, or (b) if a term has been explicitly defined to havea different meaning by reciting the term followed by the phrase “as usedin this document shall mean” or similar language (e.g., “this termmeans,” “this term is defined as,” “for the purposes of this disclosurethis term shall mean,” etc.).

References to specific examples, use of “i.e.,” use of the word“invention,” etc., are not meant to invoke exception (b) or otherwiserestrict the scope of the recited claim terms. Other than situationswhere exception (b) applies, nothing contained in this document shouldbe considered a disclaimer or disavowal of claim scope.

The subject matter recited in the claims is not coextensive with andshould not be interpreted to be coextensive with any embodiment,feature, or combination of features shown in this document. This is trueeven if only a single embodiment of the feature or combination offeatures is illustrated and described in this document. Thus, theappended claims should be given their broadest interpretation in view ofthe prior art and the meaning of the claim terms.

Spatial or directional terms, such as “left,” “right,” “front,” “back,”and the like, relate to the subject matter as it is shown in thedrawings. However, it is to be understood that the described subjectmatter may assume various alternative orientations and, accordingly,such terms are not to be considered as limiting.

Articles such as “the,” “a,” and “an” may connote the singular orplural. Also, the word “or” when used without a preceding “either” (orother similar language indicating that “or” is unequivocally meant to beexclusive—e.g., only one of x or y, etc.) shall be interpreted to beinclusive (e.g., “x or y” means one or both x or y).

The term “and/or” shall also be interpreted to be inclusive (e.g., “xand/or y” means one or both x or y). In situations where “and/or” or“or” are used as a conjunction for a group of three or more items, thegroup should be interpreted to include one item alone, all the itemstogether, or any combination or number of the items. Moreover, termsused in the specification and claims such as have, having, include, andincluding should be construed to be synonymous with the terms compriseand comprising.

Unless otherwise indicated, all numbers or expressions, such as thoseexpressing dimensions, physical characteristics, and the like, used inthe specification (other than the claims) are understood to be modifiedin all instances by the term “approximately.” At the very least, and notas an attempt to limit the application of the doctrine of equivalents tothe claims, each numerical parameter recited in the specification orclaims which is modified by the term “approximately” should at least beconstrued in light of the number of recited significant digits and byapplying ordinary rounding techniques.

All disclosed ranges are to be understood to encompass and providesupport for claims that recite any and all subranges or any and allindividual values subsumed by each range. For example, a stated range of1 to 10 should be considered to include and provide support for claimsthat recite any and all subranges or individual values that are betweenand/or inclusive of the minimum value of 1 and the maximum value of 10;that is, all subranges beginning with a minimum value of 1 or more andending with a maximum value of 10 or less (e.g., 5.5 to 10, 2.34 to3.56, and so forth) or any values from 1 to 10 (e.g., 3, 5.8, 9.9994,and so forth).

All disclosed numerical values are to be understood as being variablefrom 0-100% in either direction and thus provide support for claims thatrecite such values or any and all ranges or subranges that may be formedby such values. For example, a stated numerical value of 8 should beunderstood to vary from 0 to 16 (100% in either direction) and providesupport for claims that recite the range itself (e.g., 0 to 16), anysubrange within the range (e.g., 2 to 12.5) or any individual valuewithin that range (e.g., 15.2).

The flowchart and block diagrams in the flow diagrams illustrate thearchitecture, functionality, and operation of possible implementationsof systems, methods, and products according to various embodiments ofthe present embodiments.

It should be noted that each block of the block diagrams and/orflowchart illustrations, and combinations of blocks in the blockdiagrams and/or flowchart illustrations, may be implemented by specialpurpose hardware-based systems that perform the specified functions oracts, or combinations of special purpose hardware and computerinstructions. These computer program instructions may also be stored ina computer-readable medium that may direct a computer or otherprogrammable data processing apparatus to function in a particularmanner, such that the instructions stored in the computer-readablemedium produce an article of manufacture including instruction meanswhich implement the function/act specified in the flowchart and/or blockdiagram block or blocks.

The techniques described in this document may be implemented by one ormore computer programs executed by one or more processors. The computerprograms include processor-executable instructions that are stored on anon-transitory tangible computer readable medium. The computer programsmay also include stored data. Non-limiting examples of thenon-transitory tangible computer readable medium are nonvolatile memory,magnetic storage, and optical storage.

The operations presented in this document are not inherently related toany particular apparatus. Various general-purpose systems may also beused with programs in accordance with the teachings in this document, orit may prove convenient to construct more specialized apparatuses toperform the required method steps. The required structure for a varietyof these systems will be apparent to those of skill in the art, alongwith equivalent variations. In addition, the present disclosure is notdescribed with reference to any particular programming language. It isappreciated that a variety of programming languages may be used toimplement the teachings of the present disclosure as described in thisdocument, and any references to specific languages are provided fordisclosure of enablement and best mode of the present exemplary systemand method.

The foregoing description of the embodiments has been provided forpurposes of illustration and description. It is not intended to beexhaustive or to limit the disclosure. Individual elements or featuresof a particular embodiment are generally not limited to that particularembodiment, but, where applicable, are interchangeable and may be usedin a selected embodiment, even if not specifically shown or described.The same may also be varied in many ways. Such variations are not to beregarded as a departure from the disclosure, and all such modificationsare intended to be included within the scope of the disclosure.

1. A method of forming a glass electrochemical sensor, comprising:forming a plurality of through glass vias (TGVs) in a glass substrate;forming an electrode on a bottom surface of the glass substrate adjacentto at least one of the TGVs; and electrically connecting the electrodeto a top surface of the glass substrate through the at least one of theTGVs.
 2. The method of claim 1, further comprising: forming a cavity ina first glass layer; and bonding a first side of the first glass layerto the bottom surface of the substrate such that the electrode ispositioned within the cavity.
 3. The method of claim 2, furthercomprising: bonding a second side of the first glass layer to a secondglass layer; wherein the second glass layer is solid such that thecavity in the first glass layer is sealed except on a side defined bythe glass substrate.
 4. The method of claim 3, wherein bonding the firstglass layer to the glass substrate and bonding the first glass layer tothe second glass layer comprises: bonding the first glass layer, theglass substrate, and the second glass layer using at least one ofadhesive, glass frit, or laser sealing.
 5. The method of claim 1,further comprising coupling the glass electrochemical sensor to aprinted circuit board configured to detect a concentration of a gasentering the cavity in the first glass layer.
 6. The method of claim 1,further comprising forming a sensing port orifice in the glasssubstrate.
 7. The method of claim 1, wherein electrically connecting theelectrode to a top surface of the glass substrate through the at leastone of the TGVs further comprises depositing a conductive material inthe at least one of the TGVs.
 8. The method of claim 7, wherein theconductive material comprises copper, gold, aluminum, silver, platinum,tin, lead, a conductive polymer, or a combination thereof.
 9. The methodof claim 7, further comprising depositing an electrode material in theat least one of the TGVs.
 10. The method of claim 9, wherein theelectrode material comprises a noble metal.
 11. The method of claim 1,wherein forming a plurality of TGVs in the glass substrate furthercomprises forming the plurality of TGVs with a laser.
 12. The method ofclaim 11, wherein forming the plurality of TGVs with a laser comprises alaser ablation process or a laser damage process to localized areasfollowed by etching of the localized areas.
 13. The method of claim 2,wherein at least one of the plurality of TGVs formed in the glasssubstrate is positioned to be outside the cavity in the first glasslayer when the first glass layer is bonded to the bottom surface of thesubstrate.
 14. The method of claim 13, further comprising: forming atleast one contact TGV in the first glass layer outside of the cavitythat is configured to line up with the at least one of the plurality ofTGVs formed in the glass substrate that is positioned to be outside thecavity when the first glass layer is bonded to the bottom surface of thesubstrate; forming at least one contact TGV in the second glass layerthat is configured to line up with the at least one contact TGV in thefirst glass layer when the second glass layer is bonded to the firstglass layer; and depositing a conductive material in the at least onecontact TGV in the first glass layer, in the at least one contact TGV inthe second glass layer, and in the at least one of the plurality of TGVsformed in the glass substrate that is positioned to be outside thecavity when the first glass layer is bonded to the bottom surface of thesubstrate; wherein the conductive materially electrically couples a topsurface of the glass substrate with a bottom surface of the second glasslayer.
 15. The method of claim 14, further comprising forming aconnection bridge between the at least one of the TVGs electricallycoupled to the electrode and the conductive material deposited in the atleast one contact TGV in the first glass layer, in the at least onecontact TGV in the second glass layer, and in the at least one of theplurality of TGVs formed in the glass substrate that is positioned to beoutside the cavity when the first glass layer is bonded to the bottomsurface of the substrate.
 16. The method of claim 2, further comprisingfilling the cavity with an electrolyte.
 17. The method of claim 1,further comprising: forming at least two electrodes on the bottomsurface of the glass substrate; wherein forming a plurality of throughglass vias (TGVs) in the glass substrate includes: forming at least twoelectrical TGVs, each of the at least two electrical TGVs correspondingto and electrically connecting on of the at least two electrodes;forming at least two connection TGVs; and forming a connection bridgebetween each of the at least two connection TGVs and at least one of theat least two electrical TGVs.
 18. The method of claim 3, wherein atleast one of the glass substrate, the first glass layer, and the secondglass layer comprises a glass wafer.
 19. The method of claim 7, whereindepositing a conductive material in the at least one of the TGVscomprises depositing material by at least one of paste-filling,electroplating, physical vapor deposition, chemical vapor deposition, oratomic-layer deposition.
 20. The method of claim 1, wherein the glasssubstrate comprises at least one of Pyrex®, quartz, soda-lime glass,aluminosilicate glass, alkali-aluminosilicate glass, borosilicate glass,alkali-borosilicate glass, aluminoborosilicate glass,alkali-aluminoborosilicate glass, or fused silica glass.
 21. A glasselectrochemical sensor, comprising: a glass substrate including aplurality of through glass vias (TGVs), wherein the plurality of TGVsare at least partially filled with an electrode material; an electrodedisposed on a bottom surface of the glass substrate adjacent to at leastone of the TGVs; and a first glass layer comprising a cavity; whereinthe bottom surface of the glass substrate is bonded to a first side ofthe first glass layer such that the electrode is positioned within thecavity.
 22. The glass electrochemical sensor of claim 21, furthercomprising: at least two electrodes disposed on the bottom surface ofthe glass substrate; wherein at least two of the plurality of TGVs areelectrical TGVs that include conductive material that is electricallyconnected to the at least two electrodes.
 23. The glass electrochemicalsensor of claim 22, wherein the glass substrate further comprises: aplurality of contact TGVs containing a conductive material; and aplurality of connection bridges electrically connecting the conductivematerial in the electrical TGVs with the conductive material in thecontact TGVs.
 24. The glass electrochemical sensor of claim 23, wherein:the plurality of electrical TGVs are positioned around a center of theglass substrate; and the plurality of contact TGVs are positioned abouta periphery of the glass substrate.
 25. The glass electrochemical sensorof claim 21, further comprising: a second glass layer, wherein: thesecond glass layer is bonded to a second side of the first glass layer;and the second glass layer is solid, such that the cavity in the firstglass layer is sealed by glass on all sides except the side defined bythe glass substrate.
 26. The glass electrochemical sensor of claim 25,wherein the second glass layer is bonded to the first glass layer by atleast one of adhesive, glass frit, or laser sealing.
 27. The glasselectrochemical sensor of claim 26, wherein the bonded first glass layerand second glass layer are coupled to a printed circuit board configuredto detect a concentration of a gas entering the cavity in the firstglass layer.
 28. The glass electrochemical sensor of claim 21, whereinthe glass substrate comprises at least one of Pyrex®, quartz, soda-limeglass, aluminosilicate glass, alkali-aluminosilicate glass, borosilicateglass, alkali-borosilicate glass, aluminoborosilicate glass,alkali-aluminoborosilicate glass, or fused silica glass.
 29. Anelectronic device comprising the glass electrochemical sensor as recitedin claim
 21. 30. A method of forming a glass electrochemical sensor,comprising: forming at least two electrodes on a bottom surface of aglass substrate; forming at least two electrical TGVs, each of the atleast two electrical TGVs corresponding to and electrically connectingone of the at least two electrodes; forming at least two connectionTGVs; forming a connection bridge between each of the at least twoconnection TGVs and at least one of the at least two electrical TGVs;forming a sensing port orifice in the glass substrate; providing a firstglass layer having an orifice formed therein; and bonding a first sideof the first glass layer to the bottom surface of the substrate suchthat the electrodes are positioned within the cavity.
 31. The method ofclaim 30, further comprising: bonding a second side of the first glasslayer to a second glass layer using at least one of adhesive, glassfrit, or laser sealing; wherein the second glass layer is solid suchthat the cavity in the first glass layer is sealed except on a sidedefined by the glass substrate.
 32. The method of claim 30, furthercomprising coupling the glass electrochemical sensor to a printedcircuit board configured to detect a concentration of a gas entering thecavity in the first glass layer.
 33. The method of claim 30, whereinelectrically connecting the at least two electrical TGVs to the at leasttwo electrodes comprises depositing a conductive material in the atleast two electrical TGVs.
 34. The method of claim 33, wherein theconductive material comprises copper, gold, aluminum, silver, platinum,tin, lead, a conductive polymer, or a combination thereof.
 35. Themethod of claim 33, further comprising depositing an electrode materialin the at least two electrical TGVs.
 36. The method of claim 35, whereinthe electrode material comprises a noble metal.
 37. The method of claim30, wherein forming the at least two electrical TGVs and the at leasttwo connection TGVs further comprises forming the plurality of TGVs witha laser.
 38. The method of claim 37, wherein forming the at least twoelectrical TGVs and the at least two connection TGVs with a lasercomprises a laser ablation process or a laser damage process tolocalized areas followed by etching of the localized areas.